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| EMIF03-SIM02C2 IPADTM 3 line EMI filter including ESD protection Main product characteristics Where EMI filtering in ESD sensitive equipment is required: SIM Interface (Subscriber Identify Module) UIM Interface (Universal Identify Module) Description The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. Coated Flip-Chip package (8 bumps) Pin configuration (Bump side) 3 RST in Benefits 2 RST ext 1 A CLK ext EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free coated package Very low PCB space consuming: - 1.42mm x 1.42mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging CLK in Gnd B C Data in VCC Data ext Complies with following standards: IEC 61000-4-2 Level 4 on external and VCC pins: 15 kV 8 kV Level 1 on internal pins: 2 kV 2 kV (air discharge) (contact discharge (air discharge) (contact discharge MIL STD 883G - Method 3015-7 Class 3 March 2007 Rev 2 1/8 www.st.com Characteristics EMIF03-SIM02C2 1 Characteristics Figure 1. Basic cell configuration VCC 100 RST in R1 47 CLK in R2 100 Data in R3 Data ext CLK ext RST ext Cline = 20pF max. GND Table 1. Symbol Absolute ratings (limiting values) Parameter Internal pins (A3, B3, C3): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A2, B1, C2, C1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge Maximum junction temperature Operating temperature range Storage temperature range Value 2 2 15 8 125 -40 to +85 -55 to +150 C C C Unit VPP kV Tj Top Tstg Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Electrical characteristics (Tamb = 25 C) Parameters I Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line IPP VCL VBR VRM IRM IR VF V IF 2/8 EMIF03-SIM02C2 Characteristics Symbol VBR IRM Rd R1, R3 R2 Cline IR = 1 mA Test conditions Min 6 Typ Max 20 0.2 Unit V A VRM = 3 V 1.5 Tolerance 20% Tolerance 20% VR = 0 V 100 47 20 pF Figure 2. S21 (dB) attenuation measurement Figure 3. (A2-A3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 S21 (dB) attenuation measurement (B1-B3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 dB dB -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 100.0k 1.0M A2/A3 Line 10.0M f/Hz 100.0M 1.0G -40.00 100.0k 1.0M B1/B3 line 10.0M f/Hz 100.0M 1.0G Figure 4. S21 (dB) attenuation measurement Figure 5. (C1-C3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 dB -10.00 -20.00 Analog crosstalk measurements EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 dB -10.00 -30.00 -40.00 -20.00 -50.00 -60.00 -70.00 -30.00 -80.00 -90.00 -40.00 100.0k 1.0M C1/C3 line 10.0M f/Hz 100.0M 1.0G -100.00 100.0k 1.0M Xtalk A2/B3 10.0M f/Hz 100.0M 1.0G 3/8 Characteristics EMIF03-SIM02C2 Figure 6. Voltages when IEC 61000-4-2 (+15 kV air discharge) applied to external pin Figure 7. Voltages when IEC 61000-4-2 (-15 kV air discharge) applied to external pin Vexternal : 10V/d Vexternal : 5V/d Vinternal : 10V/d 100ns/d Vinternal : 5V/d 100ns/d Figure 8. Line capacitance versus reverse applied voltage (typical) C(pF) 20. 00 16. 00 12. 00 8. 00 4. 00 VR(V) 0. 00 0 1 2 3 4 5 Figure 9. Aplac model Lbump Rbump a2 Cbump Rsub bulk Lbump Rbump b3 Cbump Rsub bulk LbumpRbump c1 Rsub Cbump bulk Dext1 0.25 0.28 Dext2 Dext1 0.25 Bulk Dint1 Dint2 0.29 0.31 0.29 Dint1 bulk Rsub Cbump Rsub Cbump bulk 100 Rbump Lbump c3 Rsub Cbump bulk 47 Rbump Lbump b1 100 Rbump Lbump a3 Lbump Ls 100m Rbump a2 Lgnd Port1 50 Cgnd Rgnd Port2 50 a3 100m Ls 4/8 EMIF03-SIM02C2 Figure 10. Aplac parameters Ordering information scheme Ls 950pH Rs 150m Cext1 15pF Cint1 4.5pF Cext2 14pF Cint2 4pF Rbump 20m Lbump 50pH Cbump 0.15pF Rgnd 500m Lgnd 50pH Cgnd 0.15pF Rsub 100m Model Dint1 BV=15 CJO=Cint1 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Model Dext1 BV=15 CJO=Cext1 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Model Dint2 BV=15 CJO=Cint2 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n Model Dext2 BV=15 CJO=Cext2 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.001m VJ=0.6 TT=50n 2 Ordering information scheme EMIF EMI Filter Number of lines Information 3 letters = application 2 digits = version Package C = Coated Flip-Chip x = 2: Leadfree, Pitch = 500 m, Bump = 315 m yy - xxx zz Cx 5/8 Package information EMIF03-SIM02C2 3 Package information Epoxy meets UL94, V0 Figure 11. Flip-Chip Dimensions 500m 50 695m 65 315m 50 500m 50 1.42mm 50m Figure 12. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Figure 13. Footprint recommendation 1.42mm 50m Copper pad Diameter: 250 m recommended, 300 m max E Solder stencil opening: 330 m xxz y ww Solder mask opening recommendation: 340 m min for 315 m copper pad diameter 6/8 EMIF03-SIM02C2 Figure 14. Flip-Chip tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 Ordering information O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.78 +/- 0.05 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8 +/- 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 4 Ordering information Ordering code EMIF03-SIM02C2 Marking GJ Package Flip-Chip Weight 3.04 mg Base qty 5000 Delivery mode 7" Tape and reel 5 Revision history Date 07-Feb-2007 21-Mar-2007 Revision 1 2 Initial release. Updated weight in Ordering information. Changes 7/8 EMIF03-SIM02C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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